• +/- 1/8” Accuracy
• +/- 1/16” Accuracy(MCG1001)
• 0-85’ Range
• No mechanical parts
• Quality electronics provide high accuracy and reliability

The new MCG 1000SSI takes full advantage of the latest advances in large scale integration (LSI) and high density surface mount technology. A high integration application specific logic chip with microprocessor core and on-chip peripherals is the key to the SSI (Super Smart Infrared) design. On-chip RAM and ROM, multiple clock, DMA channels, and serial/parallel ports provide the MCG 1000SSI with more processing power than many of the full sized computers of just a few short years ago. A wireless, infrared remote calibrator (I/R) now programs all functions of the MCG 1000SSI on-site without ever removing the gauge cover. This hand-held remote calibrator allows interactive programming and reprogramming with initialization data. The compact single board design simplifies maintenance and reduces spare parts stocks, while the increased processing power adds features.

The new MCG 1000SSI has all of the standard temperature, analog, pulse, and discrete I/O capabilities. It also features programmed zero and span for analog ins and outs, increased diagnostics, operator programmable engineering units, and simple plug-in interface modules for protocol emulations.

As with all L&J field equipment, the MCG 1000SSI is equipped with comprehensive lightning and surge protection in an external condulet completely separate from the electronics housing. All boards are coated with a protective sealant to provide reliability even in extremely adverse operation conditions. With no mechanical parts, and quality state-of-the-art electronics, the MCG 1000SSI provides high accuracy and reliability with extremely low maintenance.

The MCG 1000SSI is made up of a sensor array and float. Magnets in a free moving float provide a magnetic field which trips discrete switches in the sensor array. The levels of those switches are sent back to the CPU for processing and display. The internal mount floats ride on the product outside of the sensor housing, while the external mount float is placed in a small externally mounted float chamber (stand pipe). The floats are weighted to float on specific products or interfaces (BS&W, product, etc.) to provide for multiple level measurements.